Device manufacturing method

ABSTRACT

A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.

BACKGROUND OF THE INVENTION

Priority is claimed on Japanese Patent Application No. 2003-15097, filedJan. 23, 2003, the content of which is incorporated herein by reference.

1. Field of the Invention

The present invention relates to a manufacturing method for a devicewhich manufactures a device by transferring elements, a devicemanufactured by the method, an electro-optic device, and electronicequipment.

2. Description of Related Art

Recently, for electro-optic devices such as liquid crystal electro-opticdevices, active matrix type devices which use thin film elements such asthin film transistors (hereunder, TFT), thin film diodes (hereunder,TFD) or the like, have become the mainstream. However, regarding theconventional electro-optic devices furnished with amorphous silicon TFTor polycrystalline silicon TFT, manufacturing cost per unit area isexpensive. Hence, in the case where large electro-optic devices are tobe manufactured, a problem is that the cost becomes very expensive. Onecause for this is the effective area utilization ratio of the transistorcircuit on the substrate of the liquid crystal electro-optic device islow, and wastage of the thin film element constituent material whichforms the film is considerable. That is to say, in the case whereamorphous silicon TFT or polycrystalline silicon TFT are to be formed onthe substrate by the conventional techniques, after film-forming theamorphous silicon on one side by CVD or the like, the unnecessary partsare removed by etching. However, the TFT circuit area inside the pixelarea is only from a few % to several 10% and the thin film elementconstituent material which is film-formed on the rest of pixel electrodepart is discarded by etching. In cases where it is possible toeffectively manufacture only the TFT circuit section on the substrate,it is possible to greatly reduce the cost, especially of largeelectro-optic devices. Therefore various techniques have been studied.

Conventionally, as a technique for arranging an LSI circuit which ismanufactured on a silicon wafer, onto another substrate, a so calledmicrostructure method developed by Alien Technology Co. is well known(for example, refer to the Information DISPLAY, Vol. 15, No. 11(November 1999)).

The microstructure technique is characterized in that it involvesseparating LSI circuits manufactured on a silicon wafer into microchips(=microstructures), and then pouring solvent dispersed with themicrostructures onto a substrate previously patterned with holes forfilling, so that the microstructures are arranged at predeterminedpositions on the substrate. According to this microstructure technique,microstructures which are formed in a large number on a silicon wafercan be dispersingly arranged on a substrate. Moreover, since this givesa discrete type arrangement where unit elements are separated on thesubstrate, the ability to follow the curvature and bending of thesubstrate is excellent, so that it is applicable to flexible substrates.

However, in the microstructure technique, there is the problem in thatreliable arrangement of the microstructures on the substrate andaccurate positioning are difficult. Moreover, since the directions inwhich the microstructures are arranged are random, special circuits tocope with this must be provided for the microstructures, with theproblem of incurring a cost increase. In the present state, this problemis avoided by designing the circuits on microstructures in four-waysymmetry.

Further, in the manufacture of color filters of liquid crystal displays,a method called an LITI process is well known, in which; a donor sheetformed by the sequential lamination of respective layers of;substrate/adhesion layer/optical absorption layer/protectivelayer/colored film layer/thermal melting adhesion layer, is superposedon an original substrate; the optical absorption layer is thenphotoirradiated for a partial area of the donor sheet; heat generatedhere melts and adheres the thermal melting adhesion layer; and as aresult only the photoirradiated area is transferred onto the substrate(for example, refer to the U.S. Pat. No. 6,057,067).

However, this conventional technique is used for manufacturing colorfilters or the like for liquid crystal display elements, and otherapplication possibilities have not been specified.

Furthermore, as a method for transferring a thin film element such as aTFT or the like formed on a substrate, to a transfer body, the presentapplicant has developed and applied to patent, a transferring method fora thin film element, which is characterized in having; a process forforming a separation layer on a substrate of high reliability and whichcan transmit laser light; a process for forming a transfer layercontaining a thin film element on the separation layer; a process foradhering the transfer layer containing the thin film element to thetransfer body via an adhesion layer; a process for photoirradiating theseparation layer and generating exfoliation in the layer and/or oninterface of the separation layer; and a process for separating thesubstrate from the separation layer (refer to the Japanese Pat.Application No. Hei 10-125931).

Likewise, the present applicant has developed and applied to patent amethod for transferring a thin film element, which is characterized inhaving: a first process for forming a first separation layer on asubstrate; a second process for forming a transfer layer containing athin film device on the first separation layer; a third process forforming a second separation layer on the transfer layer; a fourthprocess for adhering a primary transfer body on the second separationlayer, a fifth process for removing the substrate from the transferlayer with the first separation layer made a border, a sixth process foradhering a secondary transfer body on the undersurface of the transferlayer, and a seventh process for removing the primary transfer body fromthe transfer layer with the second separation layer made a border; andthe transfer layer containing the thin film device is transferred to thesecondary transfer body (refer to the Japanese Patent Application No.Hei 11-26733).

According to these transferring techniques, it is possible to transfer adetailed and high performance functional device onto a desiredsubstrate.

However, the conventional transfer techniques have the followingproblems.

That is to say, since the conventional transfer techniques are totransfer all of the thin film elements such as TFTs which are formed onthe substrate onto the final substrate, then as with an active matrixsubstrate for electro-optic devices, a large number of TFTs arerequired. However, in order to manufacture a substrate for which thearranged area of the TFTs is small with respect to the whole substratearea, it is necessary to specially manufacture a substrate where a largenumber of TFTs are formed at the same intervals as for the finalsubstrate, and transfer these to the final substrate, or it is necessaryto repeat the transfer many times, which does not always give areduction in cost.

Further, since the conventional transfer techniques are to transfer allthe thin film elements such as TFTs which are formed on the substrateonto the final substrate, then the larger the area of the substrate, thehigher the characteristic required for the irradiating laser light, thatis, the higher the power and uniformity, so that it becomes difficult toobtain a laser light source which satisfies the required performance,and large sized highly accurate irradiation equipment becomes necessaryfor the laser light irradiation. In addition, when irradiating a highpower laser light, the thin film elements may be heated above their heatresistant critical temperature, so that the function of the thin filmelement itself may be lost. Hence, there is the problem that thetransfer process itself becomes difficult.

Furthermore, similarly to the conventional transfer techniques, in thecase where the thin film elements formed on the substrate aretransferred for each device, for example, an insulating film iscontinuously formed over the whole surface of the thin film element.Therefore cracking may occur when the final substrate is bent after thetransfer, and the ability to follow the bending of the substrate is notgood. As a result, in the conventional transfer techniques, the degreeof freedom for selecting the final substrate is limited.

SUMMARY OF THE INVENTION

The present invention takes into consideration the above situation withthe object of providing, a manufacturing method for a device whichenables the manufacture of a device effectively at low cost, bydispersingly arranging elements such as TFTs on a final substrate whichbecomes an active matrix substrate for an electro-optic device, and adevice which can be manufactured effectively at low price, and anelectro-optic device and electronic equipment equipped with such adevice.

In order to achieve the above object, a manufacturing method for adevice of the present invention, in which some or all of plural elementsformed on an original substrate are transferred to a final substrate,and some or all of the transferred elements are used to manufacture thedevice, including: a first process for providing the plural elements onthe original substrate via a separation layer in a condition whereterminal sections are exposed to a surface on an opposite side to theseparation layer; a second process for adhering the surface where theterminal sections of the elements to be transferred on the originalsubstrate are exposed, via conductive adhesive, to a surface of thefinal substrate on a side where conductive sections for conducting withthe terminal sections of the elements are provided; a third process forproducing exfoliation in the separation layer between the originalsubstrate and the final substrate; and a fourth process for separatingthe original substrate from which the transfer of elements has beencompleted, from the final substrate.

According to the manufacturing method for a device of the presentinvention, it is possible to concentratedly manufacture, for example onthe original substrate, the many elements which are to be dispersinglyarranged at intervals on the final substrate. Hence, compared to thecase where elements are directly formed on the final substrate, it ispossible to greatly increase the area efficiency of the substrate whenmanufacturing elements. Consequently, it becomes possible to manufactureeffectively and at low cost, a final substrate where many elements aredispersingly arranged. As a result, the device itself can be effectivelymanufactured at low cost.

Moreover, it possible to easily execute prior to transfer, selection andremoval of bad quality elements from the many elements which areconcentratedly arranged on the original substrate. As a result, productyield rate can be increased.

Since the surface where the terminal sections of the elements areexposed is adhered via the conductive adhesive to the final substrate,then for example, by directly adhering the conductive adhesive to theconductive sections on the final substrate, adhesion of the elements tothe final substrate and conducting the terminal sections with theconductive sections can be performed at the same time. Hence, theprocess for terminal sections of the element are exposed, or to theposition to be connected to the terminal sections on the surface of thefinal substrate on the side where the conductive sections are provided.

In this manner, since this is film-like adhesive, it becomes easy tohandle the conductive adhesive, and hence productivity can be increased.

In the manufacturing method, preferably in the second process, theconductive adhesive is provided between the elements and the finalsubstrate in liquid form, and then cured.

In this manner, the degree of freedom in selecting the applicationmethod; such as for example overall coating by spin coating, selectivecoating by a liquid droplet discharge method, or various printingmethods, is higher, so that it becomes possible to select the suitableapplication method corresponding to the type of element.

In the case where the conductive adhesive is liquid form, preferably theconductive adhesive is selectively arranged by a liquid dropletdischarge method.

In this manner, since the conductive adhesive can be arranged at onlythe desired position, then for example, by arranging the conductiveadhesive only at the places corresponding to the elements to betransferred, loss of the adhesive can be reduced. Moreover, transfer ofthe elements to the final substrate can be done easily.

Preferably in the case where the conductive adhesive is selectivelyarranged by the liquid droplet discharge method, prior to this, theposition where the conductive adhesive for the elements or for the finalsubstrate is arranged is subjected to a lyophilic treatment, and/or thesurroundings of the position where the conductive adhesive is arrangedis subjected to a liquid repellent treatment.

In this way, even in the case where the droplets are discharged, shiftedfrom the desired position, due to the liquid repellent treatment, thedroplets are repelled to the conducting the terminal sections with theconductive sections by wiring after transferring becomes unnecessary.

Furthermore, it is possible to laminate and unite the same or differentelements. Therefore, by uniting the elements manufactured underdifferent process conditions, an element having a laminated structurewhich is conventionally difficult to manufacture can be provided, and anelement having a three-dimensional structure can be easily manufactured.

Furthermore, in the manufacturing method, preferably the originalsubstrate is a substrate for forming elements.

In this manner, when forming elements on the original substrate, theterminal sections thereof may be arranged on the opposite side to theoriginal substrate, that is, the outer side. Hence, it becomes easy toform the terminal sections.

In the manufacturing method, preferably the conductive adhesive is ananisotropic conductive adhesive.

In this manner, for example, in the case where there are plural terminalsections of the elements, and the conductive sections are respectivelyconducted to these terminal sections, the terminal sections and thecorresponding conductive sections are arranged to oppose each other, andare adhered by the anisotropic conductive adhesive, and pressed, so thatthe anisotropic conductive adhesive can demonstrate the anisotropythereof and conduct only between the opposing terminal sections andconductive sections. Hence, it is not necessary to form the conductiveadhesive in a condition of independence for each of the respectiveterminal sections. As a result, productivity is extremely good.

In the case where the conductive adhesive is an anisotropic conductiveadhesive, then preferably in the second process, film-like adhesive isused as the conductive adhesive, and this film-like adhesive is formedon the surface on the side where the desired position, and as a resultare applied to the desired position. Furthermore, the dropletsdischarged to the desired position, due to the lyophilic treatment, stayin that position and do not flow to the surroundings.

Preferably in the case where the conductive adhesive is selectivelyarranged by the liquid droplet discharge method, prior to this, apartition is formed to enclose the position where the conductiveadhesive for the elements or for the final substrate is arranged, andthen, the conductive adhesive is selectively arranged within thepartition.

In this manner, by arranging the conductive adhesive by dischargingwithin the partition, the conductive adhesive can be more reliablyapplied to the desired position.

In the case where the conductive adhesive is selectively arranged by theliquid droplet discharge method, prior to this, it is preferable to forma concavity at a junction position of the elements with the finalsubstrate, and then to selectively arrange the conductive adhesive inthe concavity.

In this manner, by arranging the conductive adhesive by discharging intothe concavity, the conductive adhesive can be more reliably applied tothe desired position. Furthermore, for example, in the case where theconcavity is formed in a shape to fit the element, then by fitting theelement to the concavity, positioning is possible when adhering theoriginal substrate and the final substrate. Hence, positioning whenadhering the substrates can be easily and accurately performed.Furthermore, by fitting the element into the concavity, it is possibleto thin the substrate where the elements are mounted (the finalsubstrate).

In the case where a concavity is formed at the junction position of theelement with the final substrate, and the conductive adhesive is thenselectively arranged in the concavity, it is preferable to providebeforehand in the concavity, conductive sections for conducting with theterminal sections of the elements.

In this manner, adhering the elements to the final substrate, andconducting the terminal sections with the conductive sections can beperformed at the same time. Hence, the process after transferring, forconducting the terminal sections with the conductive sections by wiringbecomes unnecessary.

In the manufacturing method, in a case where there are plural terminalsections of the elements, it is preferable to form the conductiveadhesive to be formed on these terminal sections in a condition ofindependence for each of the respective terminal sections, and toinsulate between the independent conductive adhesives.

In this manner, even if the conductive adhesive is not an anisotropicconductive adhesive but a general one, short-circuits between theterminal sections by the conductive adhesive can be prevented.

The device of the present invention is characterized in that, in adevice including elements provided on a substrate, terminal sections areprovided in an exposed condition on a surface of the elements on thesubstrate side, and conductive sections for conducting with the terminalsections of the elements are provided on the surface of the substrate onthe side where the elements are provided; and the elements are adheredto the substrate by a conductive adhesive which conducts between theterminal sections and the conductive sections.

According to this device, since the surface where the terminal sectionsof the elements are exposed, is adhered via the conductive adhesive tothe conductive sections on the substrate, then at the time ofmanufacture, a process for mounting the elements on the substrate and aprocess for conducting the terminal sections of elements with theconductive sections of the substrate are performed at the same time.Therefore, a process after mounting for conducting the terminal sectionswith the conductive sections by wiring becomes unnecessary, giving highproductivity.

In the device, preferably the conductive adhesive is an anisotropicconductive adhesive.

In this manner, for example, in the case where there are plural terminalsections of the elements, and the conductive sections are respectivelyconducted with these terminal sections, the terminal sections and thecorresponding conductive sections are arranged to oppose each other, andare adhered by the anisotropic conductive adhesive, and pressed, so thatthe anisotropic conductive adhesive can demonstrate the anisotropythereof and conduct only between the opposing terminal sections andconductive sections. Hence, it is not necessary to form the conductiveadhesive in a condition of independence for each of the respectiveterminal sections. As a result, productivity is extremely good.

Moreover, preferably in the device there are plural terminal sections ofthe elements, and the conductive adhesives to be formed on theseterminal sections are formed in a condition of independence for each ofthe respective terminal sections, and between the independent conductiveadhesives is insulated.

In this manner, even if the conductive adhesive is not an anisotropicconductive adhesive but a general one, short-circuits between theterminal sections by the conductive adhesive can be prevented.

In the case where the conductive adhesive to be formed on the terminalsections is formed in a condition of independence for each of therespective terminal sections, and between the independent conductiveadhesives is insulated, it is preferable that the conductive adhesivesare in the independent condition by arranging these conductive adhesivesseparated for each of the respective terminal sections, and between theconductive adhesives is insulated.

In this manner, short-circuits between the terminal sections by theconductive adhesive can be reliably prevented.

Moreover, in the case where the conductive adhesive to be adhered to theterminal sections is formed in a condition of independence for each ofthe respective terminal sections, and between the independent conductiveadhesives is insulated, it is preferable that the conductive adhesivesare in the independent condition for each of the respective terminalsections by separating by an insulative partition, and between theconductive adhesives is insulated.

In this manner, short-circuits between the terminal sections by theconductive adhesive can be reliably prevented.

Furthermore, in the case where the conductive adhesive to be adhered tothe terminal sections is formed in a condition of independence for eachof the respective terminal sections, and between the independentconductive adhesive is insulated, it is preferable that the conductiveadhesives are in the independent condition for each of the respectiveterminal sections by arranging into respectively independentconcavities, and between the conductive adhesives is insulated.

In this manner, short-circuits between the terminal sections by theconductive adhesive can be reliably prevented.

Moreover, the device of the present invention is characterized in beingobtained by the manufacturing methods according to any one of the aboveaspects.

According to this device, it is manufactured effectively at low cost,and product yield rate is also increased.

The electro-optic device of the present invention is characterized inbeing equipped with the aforementioned device.

According to this electro-optic device, the device is manufacturedeffectively at low cost and product yield rate is also increased, sothat the electro-optic device itself is also manufactured at low cost.

The electronic equipment of the present invention is characterized inbeing equipped with the aforementioned device.

According to this electronic equipment, the device is manufacturedeffectively at low cost and product yield rate is also increased, sothat the electronic equipment itself is also manufactured at low cost.

As described above, according to the manufacturing method for a deviceof the present invention, plural elements which are to be dispersinglyarranged at intervals on the final substrate are concentratedlymanufactured on the original substrate. Therefore, devices can bemanufactured effectively at low cost.

Moreover, the plural elements which are concentratedly manufactured onthe original substrate can be easily selected and removed before thetransfer. As a result, product yield rate can be increased.

Furthermore, since the surface where the terminal sections of theelements are exposed is adhered via the conductive adhesive to the finalsubstrate, then for example, by directly adhering the conductiveadhesive to the conductive sections on the final substrate, adhesion ofthe elements to the final substrate and conducting the terminal sectionswith the conductive sections can be performed at the same time. Hence,the process for conducting the terminal sections with the conductivesections by wiring after transferring is obviated, enablingsimplification of the processes and an increase in productivity.

Moreover, an element having a laminated structure which isconventionally difficult to manufacture can be provided, and an elementhaving a three-dimensional structure can be easily manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram of a first embodiment of a device ofthe present invention, and a side cross-section showing a first processfor forming a separation layer on an original substrate.

FIG. 2A to 2C are explanatory diagrams of a second process for formingmany elements on a separation layer, FIG. 2A is a side cross-sectionshowing a condition where many elements are formed on the separationlayer, FIG. 2B is an enlarged side cross-section of a main part fordescribing another example of formation, and FIG. 2C is an enlarged sidecross-section for showing a device.

FIG. 3A is a side cross-section showing a condition where electrode padsare formed on a final substrate, FIG. 3B is a side cross-section showinga condition where wiring 30 is connected to the electrode pads, and FIG.3C is a bottom view schematically showing an arrangement of terminalsections of elements and the electrode pads.

FIG. 4 is a side cross-section showing a condition where a film-likeanisotropic conductive adhesive is adhered to a final substrate.

FIG. 5 is a side cross-section showing a process for superposing theoriginal substrate on the final substrate and adhering them.

FIG. 6 is a side cross-section showing a process for producingexfoliation in a separation layer by partially irradiating light fromthe original substrate side.

FIG. 7 is a side cross-section showing a process for removing theoriginal substrate from the final substrate after transferring.

FIG. 8 is a schematic diagram for explaining a condition where manyelements are transferred onto the final substrate.

FIG. 9 is a side cross-section showing a condition where film-likeanisotropic conductive adhesive is adhered only to the elementtransferring area of the final substrate.

FIG. 10 is a side cross-section showing a condition where liquid formanisotropic conductive adhesive is applied onto the whole surface of thefinal substrate by spin coating.

FIG. 11 is a side cross-section showing a condition where liquid formanisotropic conductive adhesive is arranged on the electrode pads of thefinal substrate by a liquid droplet discharge method.

FIGS. 12A and 12B are diagrams for explaining the schematicconfiguration of an inkjet head, FIG. 12A is a perspective view of themain parts and FIG. 12B is a side cross-section of the main parts.

FIG. 13A to 13C are side cross-sections for explaining a method ofapplying an anisotropic conductive adhesive using a stamper.

FIG. 14 is a side cross-section showing a condition where liquid formanisotropic conductive adhesive is arranged on the electrode pads of thefinal substrate using partitions, by a liquid droplet discharge method.

FIG. 15 is a side cross-section showing a condition where liquid formanisotropic conductive adhesive is arranged inside concavities in thefinal substrate, by a liquid droplet discharge method.

FIG. 16 is a side cross-section showing a condition where conductiveadhesive is independently provided for the electrode pads formed on thefinal substrate.

FIG. 17 is a side cross-section showing a condition where conductiveadhesive is independently provided for the electrode pads formed on thefinal substrate by forming partitions.

FIG. 18 is a side cross-section showing a condition where conductiveadhesive is provided inside concavities formed in the final substrate.

FIG. 19A to 19C are diagrams showing electronic equipment related to thepresent invention, FIG. 19A shows an example of a mobile phone, FIG. 19Bshows an example of a portable information processor, and FIG. 19C showsan example of a watch type electronic equipment.

DETAILED DESCRIPTION OF THE INVENTION

Hereunder is a description of embodiments of the present invention, withreference to the drawings.

(First Embodiment)

FIG. 1 to FIG. 7 are explanatory drawings of a first embodiment of thepresent invention (element transfer method). This element transfermethod is an example of where an anisotropic conductive adhesive film isspecifically used as a conductive adhesive, and is executed through thefollowing first process to fourth process.

[First Process]

In the first process, as shown in FIG. 1, a separation layer 11 isformed on an original substrate 10, and furthermore, as shown in FIG.2A, many elements 12 are formed on the separation layer 11.

The original substrate 10 in the present embodiment, is a substrate forelement forming. Such an element forming substrate is preferably onehaving transmittance that allows transmission of light.

In this case, the transmissivity of light is preferably more than 10%,and more preferably more than 50%. If the transmissivity is too low, theloss of light becomes large, and a larger quantity of light is requiredin order to exfoliate the separation layer 11.

Moreover, preferably the original substrate 10 is constructed fromhighly reliable material, specifically, it is preferably constructedfrom materials with superior heat resistance. The reason is that forexample, when forming an element 12 or intermediate layer 16 describedlater, the process temperature may become high depending on the type orformation method (for example, around 350 to 1000° C.). However, even insuch a case, if the substrate 10 is superior in heat resistance, thenwhen forming the element 12 on the original substrate 10, the range ofsettings for the film forming conditions such as the temperatureconditions and the like, can be wider.

Therefore, if the maximum temperature when forming the element 12 isTmax, the original substrate 10 is preferably manufactured from amaterial with a distortion point greater than Tmax. Specifically, theconstituent material for the original substrate 10, preferably has adistortion point greater than 350° C., and more preferably has adistortion point greater than 500° C. As such materials, heat resistantglass such as quartz glass, Coming 7059, and OA-2 made by NipponElectric Glass Co. are given as examples.

The thickness of the original substrate 10 is not specifically limited.However it is preferably around 0.1 to 5.0 mm, and more preferablyaround 0.5 to 1.5 mm. If the thickness of the original substrate 10 istoo thin, the strength drops, while if too thick, then in the case wherethe transmissivity of the original substrate 10 is low, attenuation oflight can easily occur. In the case where the transmissivity of theoriginal substrate 10 is high, the thickness may be greater than theaforementioned upper limit. In order to evenly irradiate the light, thethickness of the original substrate 10 is preferably uniform.

The separation layer 11 is formed by materials which easily produceexfoliation by the action of mechanical force. That is to say, it isformed by such materials that; when a force acting on the separationlayer 11 in a direction to separate the original substrate 10 and alater described final substrate, is applied from one edge of thosesubstrates, it easily produces exfoliation in the layer and/or on theinterface of the separation layer 11 (hereunder, “internal exfoliation”and “interfacial exfoliation”).

Furthermore, such a separation layer 11 preferably has a characteristicof absorbing irradiated light and producing exfoliation in the layerand/or on the interface, that is to say, internal exfoliation and/orinterfacial exfoliation. Specifically, it is desired that theinteratomic or intermolecular binding strength of the constituentmaterial of the separation layer 11 is eliminated or reduced by lightirradiation, that is, ablation is produced ending in internalexfoliation and/or interfacial exfoliation.

Furthermore, in some cases gas will be released from the separationlayer 11 by the light irradiation, to manifest the separation effect.That is to say, there is the case where an element contained in theseparation layer 11 becomes a gas and is released, and the case wherethe separation layer absorbs the light and instantly becomes a gas andthe vapor thereof is released to contribute to the separation.

Examples of the constituent materials for the separation layer 11, arethose described in A–F hereunder.

A. Amorphous silicon (a-Si)

This amorphous silicon may contain hydrogen (H). In this case, it ispreferable that the H content be approximately 2 atomic percent or more,and more preferably 2 to 20 atomic percent. When a predetermined amountof hydrogen (H) is contained in this manner, hydrogen is released bylight irradiation and an internal pressure is generated in theseparation layer 11, becoming a force to separate the upper and lowerthin films. The hydrogen (H) content in the amorphous silicon can becontrolled by appropriately setting the film forming conditions, forexample, the gas composition, gas pressure, gas atmosphere, gas flowrates, temperature, substrate temperature and input power in the CVD.

B. Oxide ceramics, dielectrics (ferroelectrics) and semiconductors, suchas silicon oxides and silicates, titanium oxides and titanates,zirconium oxide and zirconates, and lanthanum oxide and lanthanates.Examples of silicon oxides include SiO, SiO₂, and Si₃O₂, and examples ofsilicates include K₂SiO₃, Li₂SiO₃, CaSiO₃, ZrSiO₄, and Na₂SiO₃.

Examples of titanium oxides include TiO, Ti₂O₃, and TiO₂, and examplesof titanates include BaTiO₄, BaTiO₃, Ba₂Ti₉O₂₀, BaTi₅O₁₁, CaTiO₃,SrTiO₃, PbTiO₃, MgTiO₃, ZrTiO₂, SnTiO₄, Al₂TiO₅ and FeTiO₃.

Examples of zirconium oxides include ZrO₂, and examples of zirconatesinclude BaZrO₂, ZrSiO₄, PbZrO₃, MgZrO₃ and K₂ZrO₃.

C. Ceramics and dielectrics (ferroelectrics), such as PZT, PLZT, PLLZT,PBZT.

D. Nitride ceramics, such as silicon nitride, aluminum nitride, titaniumnitride.

E. Organic Polymers:

Usable organic polymers have linkages (which are cut by irradiation ofthe light), such as —CH—, —CO— (ketone), —CONH— (amide), —NH— (imide),—COO— (ester), —N═N— (azo), —CH═N— (cis). In particular, any organicpolymers having large numbers of such linkages can be used. The organicpolymers may have aromatic hydrocarbons (one or more benzene rings orfused rings) in the chemical formulae.

Examples of the organic polymers include polyolefins, such aspolyethylene, and polypropylene; polyimides; polyamides; polyesters;polymethyl methacrylate (PMMA); polyphenylene sulfide (PPS); polyethersulfone (PES); and epoxy resins.

F. Metals

Examples of metals include Al, Li, Ti, Mn, In, Sn, Y, La, Ce, Nd, Pr,Gd, Sm, and alloys containing at least one of these metals.

The thickness of the separation layer 11 depends on various conditions,such as the purpose for exfoliation, the composition of the separationlayer 11, the layer configuration, and the method for forming the layer.However, normally a thickness of around 1 nm to 20 μm is preferable,more preferably around 10 nm to 2 μm, and even more preferably around 40nm to 1 μm. If the film thickness of the separation layer 11 is toosmall, uniformity in deposition may be lost, and nonuniformity may occurin the separation. If the film thickness is too thick, then in order tomaintain good peelability of the separation layer 11, it is necessary toincrease the power of light (quantity of light), and when removing theseparation layer 11 later, the operation takes time. It is preferablethat the thickness of the separation layer 2 be as uniform as possible.

The method for forming the separation layer 11 is not limited, and isdetermined depending on several conditions, such as the film compositionand thickness. Examples of the methods include vapor phase depositionprocesses, such as CVD (including MOCVD, low pressure CVD, ECR-CVD),evaporation, molecular beam (MB) evaporation, sputtering, ion-plating,and PVD; plating processes, such as electro-plating, dip-plating(dipping), and electroless-plating; coating process, such as aLangmuir-Blodgett process, spin-coating process, spray-coating process,and roll-coating process; printing processes; transfer processes;ink-jet processes; and powder-jet processes. A combination of theseprocesses may also be used.

For example, when the separation layer 11 is composed of amorphoussilicon (a-Si), it is preferable that the layer be formed by a CVDprocess, specifically a low pressure CVD or plasma CVD process.

When the separation layer 11 is formed from a ceramic by a sol-gelprocess, or formed from an organic polymer, it is preferable that thelayer be formed by a coating process, and particularly a spin-coatingprocess. Further, although not shown in FIG. 1, depending on theproperties of the original substrate 10 and the separation layer 11, anintermediate layer may be arranged between the original substrate 10 andthe separation layer 11 with an object of increasing the adhesion ofboth.

If the separation layer 11 is formed in this way, then as shown in FIG.2A, many elements 12 are formed on the separation layer 11, and then anetching process is performed so that the respective elements 12 and theseparation layer 11 immediately beneath remain as islands style. Theresult is such that, as shown in FIG. 2A, the many transferred layers(elements 12) are arranged at predetermined intervals via the separationlayer 11 on the original substrate 10. In this manner, by forming theelements 12 being the transferred layers, and the separation layer 11 asislands, it becomes easy to transfer only the desired elements 12 in anexfoliation process described later.

The separation layer 11 divided for each of the respective elements 12,as shown in FIG. 2A, may be the same size as the separation layeradhesion face of the element 12. However, it may be such that, as shownin FIG. 2B, the separation layer 11 is further over-etched so that theadhesion area of the separation layer 11 to the element 12 becomessmaller than the whole area of the separation layer adhesion face ofelement 12. In this manner, by over-etching the separation layer 11,then when the mechanical force is exerted on the separation layer 11,exfoliation is easily produced at the separation layer 11. Furthermoreas described later, when irradiating light as a pre-exfoliation process,exfoliation is easily produced. Moreover, by reducing the separationlayer 11, the amount of light energy required for exfoliation can bereduced.

FIG. 2C is a cross-section showing an example of the element 12 used inthe present embodiment. The element 12 is constructed to contain forexample a TFT (thin film transistor) formed on an SiO₂ film(intermediate layer) 16. The TFT is equipped with a source and drainarea 17 formed by introducing an n-type impurity to the polysiliconlayer, a channel area 18, a gate insulating film 19, a gate electrode20, an interlayer insulating film 21, and a source electrode 22 anddrain electrode 22 composed of for example aluminum. Here, the elements12 in the present invention, as shown in FIG. 2C, are formed in acondition where the terminal sections of the respective electrodes areexposed to a surface 12 a on the opposite side to the separation layer11. That is to say, the gate electrode 20 is formed with one surface(the surface on the opposite side to the channel area 18) exposed to thesurface 12 a of the element 12, and the source and drain electrodes 22and 22 connecting to the source (or drain area) 17 are also formed withan end surface exposed to the surface 12 a of the elements 12. On theend surface side of the source and drain electrodes 22 and 22, in orderto sufficiently maintain the contact area of the conductive adhesivedescribed later, terminal sections 22 a and 22 a are formed in acondition with their surroundings exposed to the surface 12 a.Furthermore, the surface in the gate electrode 20 on the side exposed tothe surface 12 a, also becomes a terminal section 20 a in the presentinvention.

The element 12 it is not limited to a TFT, and various elements such asa silicon base transistor, an SOI (silicon on insulator) and the likemay be applied. However, in this case also, the terminal sections suchas the electrodes are in a condition exposed to the surface on theopposite side to the separation layer 11.

Moreover, in the present invention, as the intermediate layer providedin contact with the separation layer 11, an SiO₂ film is used, however,other insulating films such as Si₃N₄ may be used. The thickness of theSiO₂ film (intermediate layer) is adequately determined corresponding tothe purpose for the formation, and the degree of function to bedemonstrated, however normally around 10 nm to 5 μm is preferable, and40 nm to 1 μm is more preferable. The intermediate layer is formed forvarious purposes, and functions as at least one of; a protective layerfor physically or chemically protecting the transferred layer (element12), an insulating layer, a conductive layer, a shading layer to laserlight, a barrier layer for preventing migration, and a reflection layer.

In some cases, the transferred layer (element 12) may be directly formedon the separation layer 11, by omitting the formation of the interlayer,such as the SiO₂ film.

The transferred layer (element 12) includes a thin film element such asa TFT, as shown in FIG. 2C. As a thin film element, besides the TFT,there are for example: thin film diodes, photoelectric transducersincluding a PIN junction of silicon (photosensor, solar battery),silicon resistive elements, other thin film semiconductor devices,electrodes (for example; transparent electrodes such as ITO and mesafilm), switching devices, memories, actuators such as piezoelectricdevices, micromirrors (piezoelectric thin film ceramics), magneticrecording thin film heads, coils, inductors, thin film high permeabilitymaterials and micro-magnetic devices composed of combinations thereof,filters, reflection films, dichroic mirrors, and the like.

Such a thin film element (thin film device) is normally formed by acomparatively high process temperature due to the forming methodtherefor. Therefore, in this case, as described above, the substrate 10must be a highly reliable material which is resistant to this processtemperature.

[Second Process]

On the other hand, as shown in FIG. 3A, a final substrate 14 isprepared. The final substrate 14 is not specifically limited, and may bea substrate (plate material), specifically a transparent substrate. Sucha substrate may be flat or curved. Further, the final substrate 14 maybe inferior to the original substrate 10 in characteristics such as heatresistance, corrosion resistance, and the like. The reason is that;since in this embodiment, the elements 12 are formed on the originalsubstrate 10, and then the elements 12 are transferred to the finalsubstrate 14, the characteristics required for the final substrate 14,specifically heat resistance, are not dependent on the temperatureconditions when forming the elements 12.

Therefore, if the maximum temperature when forming the element 12 is Tmax, a constituent for the final substrate 14 with a glass transitionpoint (Tg) or a softening point below T max can be used. For example,the final substrate 14 can be formed from a material with a glasstransition point or softening point preferably below 800° C., morepreferably below 500° C., and even more preferably below 320° C.

As the mechanical characteristics of the final substrate 14, it ispreferable to have a degree of rigidity (strength), however, it may haveflexibility or elasticity.

As such a constituent for the final substrate 14, there are varioussynthetic resins or various glasses. In particular, various syntheticresins or normal (low melting point) low cost glass are preferable.

Examples of synthetic resins include both thermoplastic resins andthermosetting resins such as; polyolefins, e.g. polyethylene,polypropylene, ethylene-propylene copolymers, and ethylene-vinyl acetatecopolymers (EVAs); cyclic polyolefins; modified polyolefins; polyesterssuch as polyvinyl chloride, polyvinylidene chloride, polystyrene,polyamides, poly-imides, polyamide-imides, polycarbonates,poly-(4-methylpentene-1), ionomers, acrylic resins, polymethylmethacrylate, acrylic-styrene copolymer (AS resin), butadiene-styrenecopolymers, polio copolymers (EVOHs), polyethylene terephthalate (PET),polybutylene terephthalate (PBT), polycyclohexane terephthalate (PCT)and the like; polyethers, polyether-ketones (PEKs),polyether-ether-ketones (PEEKs), polyether-imides, polyacetals (POMs);polyphenylene oxides; modified polyphenylene oxides; polyalylates;aromatic polyesters (liquid crystal polymers), polytetrafluoroethylene,polyvinylidene fluoride, and other fluorine resins; variousthermoplastic elastomers such as styrene-, polyolefin-, polyvinylchloride-, polyurethane-, fluorine rubber-, chlorinatedpolyethylene-type, and the like; epoxy resins, phenol resins, urearesins, melamine resins, unsaturated polyesters, silicone resins,polyurethanes, and the like; and copolymers, blends, polymer alloysessentially consisting of these synthetic resins. One or more of thesesynthetic resins may be used in combination (for example, as a compositeconsisting of at least two layers).

Examples of glass include, silicate glass (quartz glass), alkalinesilicate glass, soda-lime glass, potash lime glass, lead (alkaline)glass, barium glass, and borosilicate glass. All the types of glassother than silicate glass have lower melting points than that ofsilicate glass. Moreover, they are comparatively easy to form andprocess, and inexpensive, and therefore preferable.

Furthermore, as the final substrate 14, at the positions thereon fortransferring the elements 12 to be transferred on the original substrate10, electrode pads 15 are formed beforehand as conductive sections inthe present invention. The electrode pads 15 are for respectivelyconducting with the terminal section 20 a, and the terminal sections 22a and 22 a shown in FIG. 2C of the elements 12 formed on the originalsubstrate 10, and comprise electrode pads 15 a, 15 b and 15 c providedat positions corresponding the respective terminal sections. In thepresent embodiment, as show in FIG. 3B, wiring 30 is also formed forconnecting to these electrode pads 15 a, 15 b and 15 c. Here, theelectrode pads 15 a, 15 b and 15 c, for example as shown in FIG. 3C, arearranged corresponding to the exposed terminal section 20 a of the gateelectrode 20, and the terminal sections 22 a and 22 a of the sourceelectrode 22 and drain electrode 22, in the elements 12.

Next, in this manner, to the final substrate formed with the wiring 30,as shown in FIG. 4, film-like anisotropic conductive adhesive 31 isadhered as conductive adhesive to the formation surface of the electrodepad 15. The film-like anisotropic conductive adhesive 31 is notspecifically limited, and various kinds can be used. Examples suitablefor use include, “3370C” made by Three Bond Co., Ltd., “Anisorm” made byHitachi Chemical Co., Ltd., and “CP9631SB” made by Sony ChemicalCorporation. The film-like anisotropic conductive adhesive 31 is onewhere fine conductive particles are dispersed in an insulative resin andformed into a film-like adhesive, and it is constituted so as to becured by heat pressing. Regarding the film-like anisotropic conductiveadhesive 31 based on such a constitution, when pressed the dispersedfine conductive particles become continuous in the direction ofpressing, and consequently it attains conductivity in the direction ofpressing. At this time, in the non pressing direction the fineconductive particles remain in the dispersed condition, and hence itremains insulating.

In this manner, after adhering the anisotropic conductive adhesive 31onto the final substrate 14, then as shown in FIG. 5, the originalsubstrate 10 is aligned relative to the final substrate 14, and adheredso that the element 12 side contacts with the anisotropic conductiveadhesive 31. The alignment of the original substrate 10 to the finalsubstrate 14, is performed so that the elements 12 to be transferred arepositioned on the electrode pads 15, more precisely, so that theterminal sections 20 a, 22 a and 22 a of the element 12 are respectivelypositioned immediately above the corresponding electrode pads 15 a (15b, 15 c).

Then, by pressing one or both of the substrates in a direction to adhereto each other, and by heating in this condition, the anisotropicconductive adhesive 31 is cured. In the present embodiment, as shown inFIG. 5, the original substrate 10 side is pressed. When conducting thepress, the elements 12 to be transferred are selectively pressed, sothat the anisotropic conductive adhesive 31 can be selectively pressedonly at the places positioned immediately beneath the elements 12 to betransferred. Here, the heating for curing differs depending on theanisotropic conductive adhesive 31 used, and is performed at around 50°C. to 200° C. The thickness of the film-like anisotropic conductiveadhesive 31 is not specifically limited, but is preferably around 1 μmto 100 μm.

In this manner, after selectively pressing the anisotropic conductiveadhesive 31, and then curing by heating, the pressed area of theanisotropic conductive adhesive 31 becomes a conductive part 31 a havingconductivity in the pressing direction. Consequently, the terminalsections 20 a, 22 a and 22 a of the element 12 respectively conduct withthe corresponding electrode pads 15 a (15 b, 15 c). Moreover, regardingthe anisotropic conductive adhesive 31, since the insulativity is stillretained in the non pressing direction, then between the terminalsections 20 a, 22 a and 22 a of the element 12 and between thecorresponding electrode pads 15 a (15 b, 15 c), the mutual insulationremains, so that they are respectively electrically independent.

[Third Process]

In this manner, after adhering the elements 12 to be transferred on theoriginal substrate 10, to the final substrate 14 via the anisotropicconductive adhesive 31, exfoliation is produced in the separation layer11 between the original substrate 10 and the elements 12 to betransferred.

In order to produce exfoliation in the separation layer 11, as shown inFIG. 6, a light L is selectively irradiated using a metal mask (notshown) or the like, from the original substrate 10 side to theseparation layer 11 of the elements 12 to be transferred, so as toproduce exfoliation in the separation layer 11 and/or at the interface.By producing exfoliation in this manner, the separation layer 11 isexfoliated and the elements 12 to be transferred are separated from theseparation layer 11, giving the condition where these are adhered viathe anisotropic conductive adhesive 31 to the final substrate 14 side.

The theory of the occurrence of internal exfoliation and/or interfacialexfoliation in the separation layer 11 presumes the occurrence ofablation in the constituents of the separation layer 11, the release ofgas contained in the separation layer 11, or a phase transition such asmelting or transpiration generated immediately after the irradiation.

The word “ablation” means that solid components (the constituents of theseparation layer 11), which absorbed the incident light, arephotochemically and thermally excited and atoms or molecules on thesurface or inside the solid components are released by the chainscission. The ablation is mainly observed as phase transition such asmelting or vaporization in the partial or entire constituents of theseparation layer 11. Also, fine foaming may be formed by the phasetransition, resulting in a decreased adhering force.

The internal and/or interfacial exfoliation of the separation layer 11depends on the composition of the separation layer 11 and other factors,for example, the type, wavelength, intensity, and range of the incidentlight.

Any type of incident light which causes internal and/or interfacialexfoliation of the separation layer 11 can be used, for example, X-rays,ultraviolet rays, visible rays, infrared rays (heat rays), laser beams,milli-waves, micro-waves, electron rays, and radiations (α-rays, β-betarays, and γ-rays).

Among them, laser beams are preferable because they can easily causeexfoliation (ablation) of the separation layer 11, and are capable ofhighly accurate local irradiation. Laser light is coherent light andpreferable for producing exfoliation at the desired part by irradiatingthe high powered pulse light the via the original substrate 10 onto theseparation layer . Hence, by using laser light, it becomes possible toeasily and reliably exfoliate the elements 12.

Examples of lasers generating the laser beams include various gas lasersand solid lasers (semiconductor lasers), and excimer lasers, Nd-YAGlasers, Ar lasers, CO₂ lasers, CO lasers, and He—Ne lasers may bepreferably used.

The laser light preferably has a wavelength of 100 nm to 350 nm. In thismanner, by using the short wavelength laser light, light irradiationaccuracy becomes higher and the exfoliation in the separation layer 11can be effectively performed.

Examples of laser light that satisfy the above conditions includeexcimer lasers. The excimer laser is a gas laser which is capable ofoutputting laser light with high energy in the short wavelength UVrange. Four typical types of laser light can be output (XeF=351 nm,XeCl=308 nm, KrF=248 nm, ArF=193 nm) by combinations of rare gasses (Ar,Kr, Xe, and etc.) and halogen gasses (F₂, HCl, and etc.) as the lasermedia. Since the excimer laser outputs high energy in the shortwavelength range, it can cause ablation of the separation layer 11 in anextremely short time. Hence it can exfoliate the separation layer 11without deteriorating or damaging to the adjacent element 12.

Alternatively, in the case of imparting exfoliation characteristic tothe separation layer 11 by causing phase changes such as gas evolution,vaporization and sublimation, the wavelength of the irradiating laserlight is preferably around 350 nm to 1200 nm.

Laser light of such wavelengths may use a laser light source orirradiating device widely used in general processing fields, such as aYAG or gas laser, so that light irradiation can be performed easily atlow cost. By using such laser light of wavelength in the visible lightrange, the original substrate 10 need only be visible lighttransmitting, thus widening the degree of freedom for selecting theoriginal substrate 10.

Preferably, the energy density of the incident laser light, andparticularly of the excimer lasers, ranges from approximately 10 to5,000 mJ/cm², and more preferably approximately 100 to 500 mJ/cm². Theirradiation time preferably ranges from 1 to 1,000 nsec., and morepreferably from 10 to 100 nsec. At an energy density or irradiation timewhich is lower than the lower limit, satisfactory ablation will notoccur, whereas at an energy density or irradiation time which is higherthan the upper limit, the element 12 is adversely affected by theincident light passing through the separation layer 11.

As a solution to the case where the irradiating light which has passedthrough the separation layer 11 reaches and adversely affects theelement 12, for example, there is a method where a metal film 11 such astantalum (Ta) is formed on the separation layer 11. Accordingly, thelaser light which has passed through the separation layer 11 is fullyreflected at the interface of the metal film, and thus does notadversely affect the elements 12 thereabove.

It is preferable that the incident light including laser beams beincident on the separation layer with a uniform intensity. The incidentlight may be incident on the separation layer 11 from the directionperpendicular to the separation layer 11 or from a direction shifted bya given angle from the perpendicular direction.

The same position may be irradiated two or more times. Moreover, thesame position or different positions may be irradiated with differenttypes and/or wavelengths of incident (laser) light beams two or moretimes.

[Fourth process]

Next, as shown in FIG. 7, by applying a force on the original substrate10 and the final substrate 14 in a direction to separate both, theoriginal substrate 10 is removed from the final substrate 14. Here,since by the third process, the separation layer 11 of the elements 12to be transferred to the final substrate 14 has been exfoliated from theelements 12, the elements 12 to be transferred are separated from theoriginal substrate 10. Moreover, the elements 12 to be transferred areadhered by the anisotropic conductive adhesive 31 to the desiredposition of the final substrate 14, namely the electrode pads 15 in thepresent embodiment.

In the third process, it is desirable to produce complete exfoliation inthe separation layer 11. However, if the adhesive strength of theanisotropic conductive adhesive 31 for adhering the elements 12 to betransferred is superior to the adhesive strength due to the remainingseparation layer 11, so that as a result when the original substrate 10and the final substrate 14 are separated, the elements 12 to betransferred are reliably transferred to the final substrate 14 side,then exfoliation need only be produced in a part of the separation layer11.

By separating the original substrate 10 from the final substrate 14, asshown in FIG. 7, the elements 12 are transferred to the plural positionson the final substrate 14.

Here, regarding the film-like anisotropic conductive adhesive 31, at theplaces corresponding to the elements 12 which are not transferred,adhesion by pressing has not eventuated, and hence sufficient adhesionbetween the elements 12 which are not transferred has not eventuated.Therefore, since the separation layer 11 of the elements 12 which arenot transferred is not exfoliated, the adhesive strength between theelements 12 and the anisotropic conductive adhesive 31 is opposed sothat they easily peel off. As a result, the original substrate 10 iseasily separated from the final substrate 14.

The original substrate 10 on which untransferred elements 12 remain, canbe used for successively transferring many elements 12 onto areas of thesame final substrate 14 where the elements 12 have not been transferred,or onto another final substrate 14, by repeating the second and thirdprocesses. That is to say, in the case where the manufacturing methodfor a device of the present invention is applied, for example, to amanufacturing method for an active matrix substrate for an electro-opticdevice, microscopic elements 12 such as TFTs can be dispersinglyarranged effectively for each of the many pixels on the substrate.

There may be a case where the exfoliation residue of the separationlayer 11 is adhered on the element 12 transferred to the final substrate14, and it is desirable to completely remove this. A method for removingthe residual separation layer 11 may involve suitably selecting andusing such methods as, for example, washing, etching, ashing, grinding,or a combination of these.

Through the abovementioned respective processes it is possible toselectively transfer the many elements 12 to be transferred onto thefinal substrate 14, in the condition as shown in FIG. 8, where theterminal sections 20 a, 22 a, and 22 a are respectively adhered to theelectrode pads 15 a, 15 b and 15 c. FIG. 8 is a schematic diagram of anactive matrix substrate which is a component of an active matrix typeliquid crystal electro-optic device. Reference symbol 9 in FIG. 8denotes pixel electrodes.

Then, the transferred elements 12 are connected for example, via theelectrode pad 15 and the previously formed wiring 30, to components onthe final substrate 14 by other wiring; and are covered by a desiredprotective film, and furthermore, a device is formed by combining thefinally obtained device with other components.

According to such a device manufacturing method, the many elements 12which are to be dispersingly arranged at intervals on the finalsubstrate 14 can be concentratedly manufactured on the originalsubstrate 10. Hence, compared to the case where the elements 12 aredirectly formed on the final substrate 14, the area efficiency in themanufacture of the elements 12 can be greatly increased, and a finalsubstrate 14 with the many elements 12 dispersingly arranged can beeffectively manufactured at low cost.

Moreover, it becomes easily feasible to select and remove beforetransfer, the many elements 12 which are concentratedly manufactured onthe original substrate 10. As a result product yield rate can beincreased.

Furthermore, since the surface 12 a where the terminal sections 20 a, 22a and 22 a of the transferred elements 12 are exposed is adhered via thefilm-like anisotropic conductive adhesive 31 to the final substrate 14,the anisotropic conductive adhesive 31 is directly adhered to theelectrode pads 15 on the final substrate 14. Hence, adhesion of theelements 12 to the final substrate 14 and conduction of the terminalsections 20 a, 22 a and 22 a with the electrode pads 15 a, 15 b and 15 ccan be performed at the same time. Consequently, the process aftertransferring, for conducting the terminal sections with the electrodepad 15 by wiring is obviated, enabling simplification of the processes.

Moreover, since the original substrate 10 is substrate for forming theelements, then when forming the elements 12 on the original substrate10, the terminal sections 20 a, 22 a and 22 a should be provided on theside opposite to the original substrate 10, that is, the outer side.Hence, it is easy to form the terminal sections 20 a, 22 a and 22 a.

Furthermore, since, the conductive adhesive is an anisotropic conductiveadhesive 31, the electrode pads 15 a (15 b, 15 c) are each madeindependently conducting with the many terminal sections 20 a, 22 a and22 a of the elements 12. The terminal sections and the correspondingelectrode pads are arranged to oppose each other, and adhered by theanisotropic conductive adhesive 31 and pressed. As a result, that theanisotropic conductive adhesive 31 demonstrates its anisotropy andconducts only between the opposing terminal sections, and electrodepads. Consequently, productivity can be made extremely good.

Moreover, since the film-like adhesive is used as the anisotropicconductive adhesive 31 being a conductive adhesive, handling isfacilitated. Hence productivity can be increased.

Furthermore, it is possible to laminate and unite the same or differentelements 12. Therefore, by uniting the elements manufactured underdifferent process conditions, an element having a laminated structurewhich is conventionally difficult to manufacture can be provided, and anelement having a three-dimensional structure can be easily manufactured.

Moreover, in the device obtained in this manner, since the surface 12 awhere the terminal sections 20 a, 22 a and 22 a of the elements 12 areexposed is adhered via the anisotropic conductive adhesive 31 to theelectrode pads 15 on the substrate (final substrate 14), then during themanufacture, a process for mounting the elements 12 on the substrate(final substrate 14) and a process for conducting the terminal sections20, 22 a and 22 a of elements 12 with the electrode pads 15 of thesubstrate (final substrate 14) are performed at the same time.Consequently, the process after the mounting, for conducting theterminal sections 20, 22 a and 22 a with the electrode pads 15 by wiringbecomes unnecessary, giving high productivity.

In the device obtained by such manufacturing methods, since the elements12 constituting this are accurately positioned on the final substrate14, then different from the macrostructure used in the conventionalmicrostructure arrangement techniques, the extra symmetrical circuitstructure becomes unnecessary. Hence, extremely small microscopic blockson which are formed only the circuits to meet minimum requirements arepossible. Therefore, a very large number of elements 12 can beconcentratedly manufactured on the original substrate 10 and the costper element is greatly reduced, so that the device itself is alsoreduced in cost.

In the example, the film-like anisotropic conductive adhesive 31 servingas the conductive adhesive has its whole surface affixed to the finalsubstrate. However, as shown in FIG. 9, this may be affixed only on theelement transferring area of the final substrate 14, that is, on theelectrode pads 15. In this case, the wiring 30 for connecting to theelectrode pads 15 a, 15 b and 15 c, may be performed after transferringthe elements rather than being pre-formed. However, in this case, thewhole surface of the electrode pads 15 a, 15 b and 15 c is not coveredby the anisotropic conductive adhesive 31.

Furthermore, the film-like anisotropic conductive adhesive 31 may beaffixed to the terminal section forming surface of the elements 12,rather than to the electrode pads 15.

If so the adhesion of the original substrate 10 to the final substrate14 by pressing can be performed by appropriately pressing over the wholesurface, rather than being selectively performed.

(Second Embodiment)

The difference of the second embodiment to the first embodiment is thepoint that anisotropic conductive adhesive in paste form, that is, inliquid form, is used as the conductive adhesive, instead of thefilm-like anisotropic conductive adhesive.

In this embodiment, the final substrate 14 shown in FIG. 3B formed withthe wiring 30 for connecting to the electrode pads 15 a, 15 b, 15 c isprepared, and liquid form anisotropic conductive adhesive 32 as shown inFIG. 10 is applied on this over the whole surface by spin coating.

The liquid form (paste form) anisotropic conductive adhesive 32 is notspecifically limited, and various kinds can be used. Examples suitablefor use include “3370G” made by Three Bond Co., Ltd. This anisotropicconductive adhesive 32, as with the film-like anisotropic conductiveadhesive 32, is also formed by dispersing fine conductive particles inan insulative paste, and it is constituted so as to be cured by heatpressing.

After whole surface application of this liquid form anisotropicconductive adhesive 32 onto the final substrate 14 by spin coating, theoriginal substrate 10 is adhered via the anisotropic conductive adhesive32 onto the final substrate 14. Then, similarly to the first embodiment,only the places immediately below the elements 12 are selectivelypressed and heated, so that the anisotropic conductive adhesive 31 iscured. Here, the heating for curing also differs depending on theanisotropic conductive adhesive 32 used, but is performed at around 50°C. to 200° C. The thickness of the liquid form anisotropic conductiveadhesive 32, it is not specifically limited, but is preferably around 1μm to 100 μm.

Hereunder, similarly to the first embodiment, exfoliation and separationof substrates is performed, to form the device.

Also with such a device manufacturing method, and the device obtained bythis, similar effects to the case of the first embodiment can beobtained.

Specifically, since the liquid form anisotropic conductive adhesive 32is used as the anisotropic conductive adhesive, the whole surfaceapplication can be easily performed by spin coating. Hence productivitycan be increased.

(Third Embodiment)

The difference of the third embodiment to the second embodiment is thepoint that the liquid form anisotropic conductive adhesive 32 isselectively arranged by a liquid droplet discharge method such as aninkjet method, a dispenser method, or the like, instead of whole surfaceapplication by spin coating.

In this embodiment, the final substrate 14 shown in FIG. 3B formed withthe wiring 30 for connecting to the electrode pads 15 a, 15 b and 15 cmay be used. However, as shown in FIG. 11, the final substrate 14 formedwith only the electrode pads 15 a, 15 b and 15 c before forming thewiring 30 may also be used.

In the case where the final substrate formed with the only the electrodepads 15 a, 15 b and 15 c is used, the anisotropic conductive adhesive 32being in liquid form is discharged from a droplet discharge section, forexample, an inkjet head H, so as not to cover the whole surface of theseelectrode pads 15 a, 15 b and 15 c. Discharge of the anisotropicconductive adhesive 32 may be performed not for the final substrate 14but for the terminal section forming surface 12 a.

To describe an example of the construction of the inkjet head H, theinkjet head H, as shown in FIG. 12A, comprises for example a nozzleplate 40 made from stainless steel and a diaphragm 41, with bothconnected via a partition member (reservoir plate) 42. Between thenozzle plate 40 and the diaphragm 41 are formed by means of thepartition member 42, a plurality of cavities 43 and liquid reservoirs44. The respective cavities 43 and the interior of the liquid reservoirs44 are filled with discharge liquid, and the cavities 43 and the liquidreservoirs 44 are communicated via a supply port 45. In the nozzle plate40 are formed nozzles 46 for discharging the discharge liquid from thecavities 43. On the other hand, in the diaphragm 41 is formed a hole 47for supplying the discharge liquid to the liquid reservoirs 44.

As shown in FIG. 12B, piezoelectric elements (piezo device) 48 areattached to the surface of the diaphragm 41 on the opposite side to thesurface facing the cavities 43. The piezoelectric elements 48 arepositioned between a pair of electrodes 49, and configured so as to flexand protrude outwards when energized. Based on such a configuration, thediaphragm 41 to which the piezoelectric element 48 is attached, isintegrated with the piezoelectric element 48 and thus flexes outwards atthe same time. As a result, the volume of the cavity 43 increases.Consequently, discharge liquid equivalent to the increased volume flowsin to the interior of the cavity 43 from the liquid reservoir 44 via thesupply port 45. Furthermore, when from such a condition, energizing ofthe piezoelectric element 48 is terminated, both the piezoelectricelement 48 and the diaphragm 41 return to their initial shapes.Therefore, the cavity 43 returns to the initial volume, and hence thepressure of discharge liquid inside of cavity 43 increases, and adroplet L of the anisotropic conductive adhesive 32 being the dischargeliquid is discharged from the nozzle 46 towards the final substrate 14.

The inkjet method for the inkjet head H, is not limited to the piezo jettype using the piezoelectric element 48, and various methods can beadopted.

In this manner, once the anisotropic conductive adhesive 32 has beenselectively applied onto electrode pads 15 on the final substrate 14, oronto the terminal section forming surface 12 a of the elements 12, theoriginal substrate 10 is adhered via this anisotropic conductiveadhesive 32, onto the final substrate 14. Then, similarly to the secondembodiment, pressing and heating is performed so that the anisotropicconductive adhesive 31 is cured. Furthermore, wiring (not shown) forconnecting to the electrode pads 15 a, 15 b and 15 c is formed. However,in this case, since the anisotropic conductive adhesive 32 isselectively applied previously, the adhesion of the original substrate10 to the final substrate 14 by pressing is not selectively performed,and can be performed by suitably pressing over the whole surface.

Hereunder, similarly to the first embodiment, exfoliation and separationof the substrates is performed to form the device.

Also with such a device manufacturing method, and the device obtained bythis, similar effects to the case of the first embodiment can beobtained.

Furthermore, since the liquid form anisotropic conductive adhesive 32can be selectively arranged as the conductive adhesive on only thedesired positions, then by selectively arranging the anisotropicconductive adhesive 32 onto the electrode pads 15 on the final substrate14, loss of adhesive can be reduced. Moreover, transfer of the elementsto the final substrate can be done easily.

(Fourth Embodiment)

The difference of the fourth embodiment to the third embodiment is thepoint that instead of selectively arranging the liquid form anisotropicconductive adhesive 32 by the liquid droplet discharge method, this isselectively applied by screen printing. The process after application isthe same as for the third embodiment.

In this way, as well as obtaining similar effects to the case of thefirst embodiment, the effect of reducing the loss of the adhesive can bealso obtained.

(Fifth Embodiment)

The difference of the fifth embodiment to the third embodiment is thepoint that instead of selectively arranging the liquid form anisotropicconductive adhesive 32 by the liquid droplet discharge method, this isselectively applied a stamper.

That is to say, in the fifth embodiment, as shown in FIG. 13A, a stamper33 having convex application sections 33 a at positions for applying theanisotropic conductive adhesive 32 is prepared. This stamper 33 isinserted into a container 34 storing the anisotropic conductive adhesive32, and as shown in FIG. 13B, the anisotropic conductive adhesive 32adheres to the application sections 33 a. Next, as shown in FIG. 13C,the stamper 33 is aligned on the final substrate 14 or on the originalsubstrate 10, and in this condition, the application sections 33 arepressed for a predetermined time onto the electrode pads 15 of the finalsubstrate 14 or onto the elements 12 of the original substrate 10, andthen separated. Therefore, the anisotropic conductive adhesive 32 whichis adhered onto the application sections 33 a shifts onto the electrodepads 15 or the elements 12. As a result, the anisotropic conductiveadhesive 32 is selectively applied.

The processes after application are the same as for the thirdembodiment.

In this way, as well as obtaining a similar effect to the case of thefirst embodiment, the effect of being able to reduce the loss of theadhesive is also obtained. Moreover, this gives a superior method formass production.

(Sixth Embodiment)

The difference of the sixth embodiment to the third embodiment is thepoint that, prior to selectively arranging of the liquid formanisotropic conductive adhesive 32 by the liquid droplet dischargemethod, partitions are formed for enclosing the positions where theanisotropic conductive adhesive 32 is arranged. Then the anisotropicconductive adhesive 32 is selectively arranged within these partitions.

That is to say, in the sixth embodiment, as shown in FIG. 14, on theelectrode pads 15 of the final substrate 14, partitions 34 are formed atperipheral portions enclosing the central upper surface of the electrodepads 15. Then, the anisotropic conductive adhesive 32 is selectivelyarranged inside the partitions 34, by a liquid droplet discharge methodsuch as the inkjet method or a dispenser method (FIG. 14 shows the caseperformed by the inkjet method). The partitions 34 are formed byapplying resin such as resist and then patterning by a photolithographytechnique. Further, after applying the anisotropic conductive adhesive32, the partitions 34 are removed by etching.

The processes after applying the anisotropic conductive adhesive 32 inthis manner and then removing the partitions 34, are the same as for thethird embodiment.

In this way, as well as obtaining a similar effect to the case of thefirst embodiment, by discharging the anisotropic conductive adhesive 32into the partitions 34 to arrange this, the anisotropic conductiveadhesive 32 can be more reliably applied to the desired positions.

(Seventh Embodiment)

The difference of the seventh embodiment to the third embodiment is thepoint that prior to selectively applying the anisotropic conductiveadhesive 32 onto the final substrate 14, concavities are formed in thefinal substrate 14 at junction positions with the elements 12, and thenanisotropic conductive adhesive 32 is selectively arranged inside theconcavities.

That is to say, as shown in FIG. 15, using a photolithography techniqueor an etching technique on the final substrate 14, concavities 35 areformed, and the electrode pads 15 are formed inside the concavities 35and at the peripheries. After this, the anisotropic conductive adhesive32 is selectively applied into the concavities 35.

The processes after application are the same as for the thirdembodiment.

In this way, as well as obtaining a similar effect to the case of thefirst embodiment, by discharging the anisotropic conductive adhesive 32into the concavities 35 to arrange this, the anisotropic conductiveadhesive 32 can be more reliably applied to the desired position.

Furthermore, for example, if the concavities 35 are formed into shapesto fit the elements 12, then the alignment when adhering the substrate10 for transferring and the final substrate 14 can be performed byfitting the elements 12 to the concavities 35. Therefore, alignment whenadhering the substrate pairs can be performed easily and accurately.

Furthermore, by fitting the elements 12 into the concavity 35, the filmthickness of the substrate mounting the elements 12 (the final substrate14) can be made thinner.

(Eighth Embodiment)

The difference of the eighth embodiment to the third embodiment is thepoint that prior to selectively applying the anisotropic conductiveadhesive 32 onto the final substrate 14, the position where theanisotropic conductive adhesive 32 is arranged on the elements 12 or onthe final substrate 14 is subjected to a lyophilic treatment, and/or theperiphery of the position where the anisotropic conductive adhesive 32is arranged is subjected to a liquid repellent treatment.

Here the liquid repellent treatment can be performed for example byforming a SAM (Self Assembled Mono layer) film using a fluororesin suchas hexafluoropolypropylene. On the other hand, as the lyophilictreatment, lyophilication of the irradiated parts can be performed byselectively performing ultraviolet irradiation using a mask, on theliquid repellent treated area. Furthermore, apart from the liquidrepellent treatment, by performing plasma processing with oxygen as theprocess gas, on the desired area, it is possible to treat the surface tomake the desired part lyophilic.

Then, for example, on the electrode pads 15, the parts except for thearea for connecting the wiring 30 are made lyophilic, or the area forconnecting the wiring 30 is made liquid repellent, and in thiscondition, the anisotropic conductive adhesive 32 is discharged andarranged on the lyophilic treated part by the liquid droplet dischargemethod.

In this way, even if the anisotropic conductive adhesive 32 isdischarged shifted from the desired position, due to the liquidrepellent treatment at the shifted position, the anisotropic conductiveadhesive 32 is repelled to the desired position, and as a result, isapplied to the desired position. Furthermore, the anisotropic conductiveadhesive 32 discharged to the desired position, due to the lyophilictreatment, stays in the position and does not flow to the surroundings.

Hence, according to the eighth embodiment, as well as obtaining asimilar effect to the case of the first embodiment, the anisotropicconductive adhesive 32 can be more reliably applied to the desiredposition.

In the above embodiments, anisotropic conductive adhesive is used as theconductive adhesive, however, the present invention is not limited tothis, and general conductive adhesive may be used rather than suchanisotropic conductive adhesive, that is to say, conductive adhesivefilm, or conductive adhesive paste. Here, examples of conductiveadhesive film suitable for use include “3316” made by Three Bond Co.,Ltd. Furthermore, examples of conductive adhesive paste include “3301”made by Three Bond Co., Ltd., “Unimec conductive paste” made by NAMICSCorporation, and “Ombond” made by OMRON Corporation.

Such conductive adhesive film or conductive adhesive paste, in the casewhere there is one terminal section for the element 12 to betransferred, can be used similarly to the abovementioned film-likeanisotropic conductive adhesive 31 in the first embodiment, or the pasteform anisotropic conductive adhesive 32 in the second embodiment.

In the case where there are plural terminal sections for the element 12,it is necessary to form the conductive adhesive for adhering to theseterminal sections in the condition of independence for each of therespective terminal sections, and to insulate between the independentconductive adhesives. The reason for this is so that short-circuitsbetween the terminal sections by the conductive adhesive can beprevented.

Hereunder embodiments are illustrated for the case where there areplural terminal sections for the elements 12.

(Ninth Embodiment)

The difference of the ninth embodiment to the third embodiment is thepoint that, as described above, the conductive adhesive is notanisotropic conductive adhesive but general conductive adhesive, and thepoint that the conductive adhesive is made in a condition ofindependence by positioning apart for each of the respective terminalsections, to thereby insulate between the conductive adhesives.

That is to say, as shown in FIG. 16, for the electrode pads 15 a, 15 band 15 c formed on the final substrate 14, there is providedindependently for each, film-like, or paste-like (liquid form)conductive adhesive 36. Next, the original substrate (not shown) isadhered, and the respective terminal sections 20 a, 22 a and 22 a of theelements 12 are adhered via the conductive adhesive 36 to thecorresponding electrode pads 15 a (15 b, 15 c). Then, as necessary, theconductive adhesive 36 is cured by heat treatment or the like.

The processes after providing the conductive adhesive 36 in this mannerand then curing as necessary, are the same as for the first embodimentor the third embodiment.

In this way, since the surface where the terminal sections 20 a, 22 aand 22 a of the elements 12 are exposed are adhered via the conductiveadhesive 36 to the electrode pads 15 a (15 b, 15 c) on the finalsubstrate 14, then during manufacture, the process for mounting theelements 12 on the final substrate 14, and the process for conductingthe terminal sections 20 a, 22 a, 22 a of the elements 12 with theelectrode pads 15 of the final substrate 14 can be performed at the sametime. Hence, the process for conducting the terminal sections 20 a, 22 aand 22 a with the electrode pads 15 by wiring after mounting can beeliminated, and the processes thus simplified.

Furthermore, despite of using general conductive adhesive 36 which isnot anisotropic, short-circuits between the terminal sections 20 a, 22 aand 22 a by the conductive adhesive 36 can be reliably prevented.

When arranging the conductive adhesive 36 separated for each of therespective terminal sections, it is preferable to do this using pasteform adhesive which can be changed to liquid form, as the conductiveadhesive 36, and selectively apply this by the liquid droplet dischargemethod. In this case, it is preferable to more reliably perform theselective application of the conductive adhesive 36 by performing thelyophilic treatment and the liquid repellent treatment illustrated inthe eighth embodiment.

(Tenth Embodiment)

The difference of the tenth embodiment to the ninth embodiment is thepoint that, as a method for making the conductive adhesive 36 in anindependent insulated condition for each of the respective terminalsections, the conductive adhesive 36 is separated by insulativepartitions.

That is to say, in the tenth embodiment, as shown in FIG. 17, for eachof the electrode pads 15 a, 15 b and 15 c corresponding to therespective terminal sections 20 a, 22 a and 22 a, an insulativepartition 37 is formed similarly to with the sixth embodiment, and thepartition 37 formed by this, functions to separate between the electrodepads 15 a and 15 b, and also between the electrode pads 15 b and 15 c.When forming the partitions 37, in the case where the wiring 30 isconnected to the electrode pads 15 a, 15 b and 15 c by a subsequentprocess, the arrangement is such that the connection parts remain out ofthe partition 37.

Then, after forming the partitions 37 in this way, paste form adhesivewhich is adjustable to liquid form is used as the conductive adhesive36, and this is selectively discharged and arranged inside thepartitions 37 by the liquid droplet discharge method. Next, the originalsubstrate (not shown) is adhered, and the respective terminal sections20 a, 22 a and 22 a of the elements 12 are adhered via the conductiveadhesive 36 to the corresponding electrode pads 15 a (15 b, 15 c). Thenthe conductive adhesive 36 is cured by heat treatment or the like.

After curing the conductive adhesive 36 in this way, the wiring 30 isconnected to the electrode pads 15 a, 15 b and 15 c as necessary, andthereafter the subsequent processes are performed similarly to with thethird embodiment.

In this way, similarly to with the ninth embodiment, the process forconducting the terminal sections 20 a, 22 a and 22 a with the electrodepads 15 by wiring after mounting of the elements 12 can be eliminated,and the processes thus simplified.

Furthermore, since between the terminal sections 20 a and 22 a (betweenthe electrode pads) is insulated by the partitions 37 which giveseparation, short-circuits between the terminal sections 20 a, 22 a and22 a by the conductive adhesive 36 can be reliably prevented.

In the tenth embodiment, after curing the conductive adhesive 36, thearrangement of the ninth embodiment can be obtained by selectivelyremoving (etching) only the partition 37.

(Eleventh Embodiment)

The difference of the eleventh embodiment to the ninth embodiment is thepoint that as a method for making the conductive adhesive 36 in anindependent insulated condition for each of the respective terminalsections, the conductive adhesive 36 is arranged inside respectiveindependent concavities.

That is to say, in the eleventh embodiment, as shown in FIG. 18,respective independent concavities 38 are formed in the surface layerportion of the final substrate 14, and the electrode pads 15 a, 15 b and15 c corresponding to the respective terminal sections 20 a, 22 a and 22a are respectively provided in these concavities 38. These electrodepads 15 a, 15 b and 15 c are connected to wiring 30 (not shown) asnecessary.

Then after respectively providing the electrode pads 15 a (15 b, 15 c)in the concavities 38 in this way, paste form adhesive which isadjustable to liquid form is used as the conductive adhesive 36, andthis is selectively discharged and arranged inside the concavities 38 bythe liquid droplet discharge method. In this case, it is desirable tomore reliably perform selective application of the conductive adhesive36, by performing lyophilic treatment inside the concavities 38 andliquid repellent treatment of the surroundings of the concavities 38 asillustrated in the eighth embodiment.

Next, the original substrate (not shown) is adhered, and the respectiveterminal sections 20 a, 22 a and 22 a of the elements 12 are adhered viathe conductive adhesive 36 to the corresponding electrode pads 15 a (15b, 15 c). Then the conductive adhesive 36 is cured by heat treatment orthe like.

After curing the conductive adhesive 36 in this way, thereafter thesubsequent processes are performed similarly to with the thirdembodiment

In this way, similarly to with the ninth embodiment, the process forconducting the terminal sections 20 a, 22 a and 22 a with the electrodepads 15 by wiring after mounting of the elements 12 can be eliminated,and the processes thus simplified.

Furthermore, since between the terminal sections 20 a and 22 a (betweenthe electrode pads) it insulated by respectively independently formingthe concavities 38, short-circuits between the terminal sections 20 a,22 a and 22 a by the conductive adhesive 36 can be reliably prevented.

In the abovementioned embodiments, the arrangement is such that theoriginal substrate 10 is the substrate for element forming, however thepresent invention is not limited to this. For example, the substrate forelement forming and the original substrate in the present invention maybe separate, and the elements transferred temporarily from the substratefor element forming to the original substrate, after which the elementsare again transferred to the final substrate. Furthermore, thetransferring from the substrate for element forming to another originalsubstrate may be performed once or several times, after which theelements are transferred to the final substrate via the originalsubstrate of the present invention.

Here, devices obtained by such a manufacturing method, are notspecifically limited, and the method is applicable to any device as longas a constituent is an element such as a semiconductor element or anoptical element. The method can be applied to various devices, forexample, various kinds of semiconductor devices having switchingelements such as memories or TFTs, electro-optic devices such as organicelectroluminescence devices, liquid crystal displays, electrophoresisapparatus, plasma display units, and also optical devices such as laserequipment.

Examples of electronic equipment of the present invention are thosehaving the abovementioned electro-optic device as a display panel,specifically as shown in FIG. 19.

FIG. 19A is a perspective view showing an example of a mobile phone. InFIG. 19A, reference numeral 600 denotes the main body of the mobilephone, and 601 denotes a display panel having the abovementionedelectro-optic device.

FIG. 19B is a perspective view showing an example of a portableinformation processor such as word processor or personal computer. InFIG. 19B, reference numeral 700 denotes an information processor, 701denotes an input section such as keyboard, 703 denotes a main body ofthe information processor, and 702 denotes a display panel having theabove mentioned electro-optic device.

FIG. 19C is a perspective view showing an example of a watch typeelectronic equipment. In FIG. 19C, reference numeral 800 denotes a mainbody of the watch and 801 denotes a display panel having theabovementioned electro-optic device.

The electronic equipment shown in FIG. 19A to 19C are furnished withdisplay panels having the abovementioned electro-optic devices, thusgiving a high productivity low cost product.

While preferred embodiments of the invention have been described andillustrated above, it should be understood that these are exemplary ofthe invention and are not to be considered as limiting. Additions,omissions, substitutions, and other modifications can be made withoutdeparting from the spirit or scope of the present invention.Accordingly, the invention is not to be considered as being limited bythe foregoing description, and is only limited by the scope of theappended claims.

1. A manufacturing method for a device in which some or all of pluralelements formed on an original substrate are transferred to a finalsubstrate, and some or all of the transferred elements are used tomanufacture the device, comprising: a first process for providing theplural elements on said original substrate via a separation layer in acondition where terminal sections are exposed to a surface on anopposite side to the separation layer; a second process for adhering thesurface where the terminal sections of said elements to be transferredon the original substrate are exposed, via conductive adhesive, to asurface of the final substrate on a side where conductive sections forconducting with the terminal sections of said elements are provided; athird process for producing exfoliation in said separation layer betweensaid original substrate and said final substrate; and a fourth processfor separating said original substrate from which the transfer ofelements has been completed, from said final substrate.
 2. Themanufacturing method for a device according to claim 1, wherein saidoriginal substrate is a substrate for forming elements.
 3. Themanufacturing method for a device according to claim 1, wherein saidconductive adhesive is an anisotropic conductive adhesive.
 4. Themanufacturing method for a device according to claim 3, wherein in saidsecond process, a film-like anisotropic conductive adhesive is used assaid conductive adhesive, and said film-like adhesive is adhered to thesurface on the side where the terminal sections of said element areexposed, or to a portion to be connected to said terminal sections onthe surface of said final substrate on the side where the conductivesections are provided.
 5. The manufacturing method for a deviceaccording to claim 1, wherein in said second process, said conductiveadhesive is provided between each of the elements and the finalsubstrate in liquid form, and then cured.
 6. The manufacturing methodfor a device according to claim 5, wherein in said second process, saidconductive adhesive is selectively arranged by a liquid dropletdischarge method.
 7. The manufacturing method for a device according toclaim 6, wherein prior to selectively arranging said conductive adhesiveby the liquid droplet discharge method, each of the elements, or aportion on the final substrate where the conductive adhesive isarranged, is subjected to a lyophilic treatment, and/or the surroundingsof the portion of the final substrate where the conductive adhesive isarranged is subjected to a liquid repellent treatment.
 8. Themanufacturing method for a device according to claim 6, wherein prior toselectively arranging said conductive adhesive by the liquid dropletdischarge method, a partition is formed to enclose the conductivesection where the conductive adhesive for each of the elements or forthe final substrate is arranged, and then, the conductive adhesive isselectively arranged within said partition.
 9. The manufacturing methodfor a device according to claim 6, wherein prior to selectivelyarranging said conductive adhesive by the liquid droplet dischargemethod, a concavity is formed in the final substrate at a junctionportion of each of the elements with the final substrate, and then theconductive adhesive is selectively arranged in said concavity.
 10. Themanufacturing method for a device according to claim 9, wherein each ofconductive sections for conducting with the terminal sections of thecorresponding elements is provided in said concavity before theconductive adhesive is selectively arranged in said concavity.
 11. Themanufacturing method for a device according to claim 1, wherein in acase where there are plural terminal sections of said elements, theconductive adhesive to be formed on each of the terminal sections isformed in a condition of independence for each of the respectiveterminal sections, and the conductive adhesives on each of the terminalsections are insulated from each other.